bonding layer

Impact of the chip bonding layer material on the thermal resistance of power LED

芯片键合层材料对功率型LED热阻的影响

Research on Bonding Layer of Transfer Foil Operation

转印箔中粘接层的研究

Technique, such as electronic probe, XRD, optical microscope, micro-hardness and macro hardness test, are applied to investigate the microstructure, phase structure, and analyze the alloy element distribution of metallurgical bonding layer and the material mechanical property changes.

利用电子探针、XRD、光学显微镜、显微硬度和宏观硬度测试等手段，研究扩散件试样的显微组织、物相结构，分析冶金结合层中合金元素分布和材料内部力学性能变化。

TEM study of bonding layer in Cu-Al explosively welded joint

Cu－Al爆炸焊结合层的透射电镜研究

The Distributed Force Model of Intelligent Beam Structures Based on Effect of Bonding Layer

考虑粘贴层影响的智能结构梁分布力模型

The capability variation rule of bonding layer was also analysed.

采用滑动磨损法检测了耐磨性，并分析了衬瓷层性能的变化规律。

Through its two materials closely bonding layer, which is guaranteed to multilayer structure integrity.

通过它紧密粘接两种材料层, 即能保证多层材料的结构完整性.

Two dimensional finite element analysis of ceramic veneer bonding layer

对瓷贴面粘结层的有限元应力分析